New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com PRODUCT PARAMETERS Condition: new and original Warranty: 12 m
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Tel : +86 592 5165503 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com PRODUCT PARAMETERS Condition: new and original Warranty: 12 m
Electronics Forum | Thu Mar 31 11:15:25 EDT 2022 | proceng1
So the NEW component is SOT-23? What is the foot print on the board?
Electronics Forum | Thu Jun 07 13:49:21 EDT 2007 | rrozell
I am working on finding out the foot prints of Panasonic MV2V and a GSM2.
Used SMT Equipment | SMT Equipment
JUKI KE-2070L Pick and Place Machine Specification Model :KE-2070L ■ Laser mount head * 1 (6 suction nozzle) ■ PCB Board Size： L (50*30-410*360mm) ■ Component height: 6mm ■ Component mount range: Laser Recognition: 0402(0100
Used SMT Equipment | Coating and Encapsulation
Model: PVA650 Vintage: December 2008 Description: Conformal Coat Details: • Software 3.0.0 Build 106 • 120 Vac, 60 HZ,12 Amps • PCB Max 18x18x4 Condition: Complete & Operational Location & Shipping: US
Industry News | 2015-08-26 18:05:48.0
Vi TECHNOLOGY will exhibit in Booth #808 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate its complete SMT inspection solutions, including the PI series (SPI), K series (AOI) and Sigma Link software suite.
Industry News | 2019-01-30 21:02:28.0
Hanwha Techwin Automation Americas today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Parts & Supplies | Other Equipment
Juki KE2050, KE2060, FX-1, FX-3 P/N: E3665X-729-0A0 Des: Nozzle,#500 (0.5×1.0) P/N: #501 Des: Nozzle,#501 (0.7×0.4 / 0.25 Holes) P/N: #502 Des: Nozzle,#502 (0.7/0.35) P/N: #503 Des: Nozzle,#503 (1.0/0.6) P/N: E3656-729-0A0 Des: No
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Parts & Supplies | Other Equipment
I-Pulse smt pick and place nozzles SMT NOZZLES ON I PULSE MACHINES Machine i-Pulse M1,M4,M6ex,M7,M8 (P Type Nozzles) P/N: LG0-M7703-00 Des: Nozzle,M002 0.95mmx0.65mm P/N: LG0-M7703-00XS Des: Nozzle,M002 (modified) 0.7/0.45 P/N: LG0-M7
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
This powerful soldering system makes the most challenging applications so effortless, take a look! Courtesy of our German distributor Conrad: OKi Metcal Löt- und Rework-System. The MFR-1110 is available on the Metcal webstore and from all our authori
250,000 square foot printed circuit assembly facili
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/lcc-differences-between-lp-wizard-and-pcb-library_topic1251.html
: 13 Post Options Post Reply Quote pcbsteve Report Post Thanks(1) Quote Reply Posted: 07 Feb 2014 at 4:50am Hi, I notices some differences in the IPC Most foot print generated by LP Wizard 10.5 (Mentor Graphics
| http://etasmt.com:9060/te_news_bulletin/2020-09-19/19361.chtml
. This stage is the most important. When the individual solder particles are completely melted, they combine to form liquid tin. At this time, the surface tension starts to form the surface of the solder foot, and the molecular motion is violent, so that the liquid tin and copper form a good alloy
